CALCE Webinar - Vibration Interconnect Fatigue: Have You Considered Temperature?

Tuesday, June 9, 2020
11:00 a.m.-12:00 p.m.

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Abstract

Electronic products are exposed to a combination of loading types in their application environments. In particular, the combination of vibration and temperature can cause electronic devices to fail. This combination occurs in many applications, e.g. in oil/gas exploration as well as in locomotives, aerospace, shipboard, and automotive platforms. Combined vibration and temperature conditions can cause fatigue of material systems used to interconnect electronic devices on a printed wiring board. In particular, solder interconnects, copper traces, and device terminals can fracture creating open circuits in electronic assemblies. To assure the reliability of electronic products that are subjected to vibration at different temperatures, the ability to define acceleration factors between test conditions and end-use conditions is needed.

This webinar will review efforts to understand failure in electronic assemblies under vibration at different temperatures as well as methods for predicting life expectancies. The test vehicle for this study is an 0805 chip resistor interconnected to a printed wiring board with SnAg1.0Cu0.5 solder. As a first step, it is important to understand the impact of temperature on vibration induce failure. To understand the effect of temperature of vibration failure, vibration tests were run at three separate temperatures. For each temperature a new test assembly was used. In this study, test temperatures included -40C, 25C, and 125C. The conditions were selected to match a common test condition of -40 to 125C temperature cycle. Detailed non-linear finite element analysis is used to characterize the stress-strain history in the assembly and determine strain at locations of concern using finite element-based strain transfer functions. Non-destructive and destructive physical analysis is used to identify the failure site and mechanism. Finally, constants are derived for a generalized Basquin-Coffin-Manson fatigue life model for -40 C, 25C, and 125C temperatures under harmonic vibration.

About the Presenter: David Leslie is currently a PhD candidate in Mechanical Engineering and a graduate research assistant at the Center of Advanced Life Cycle Engineering (CALCE), at the University of Maryland, College Park. He is advised by Professor Abhijit Dasgupta, and his dissertation research is in the field of nanoindentation of viscoplastic heterogeneous solids with specific application to pressure-less sintered silver interconnect materials used in high-temperature electronic systems. He has authored numerous papers in international and national conferences and made numerous research presentations to CALCE sponsors. Before arriving at UMD, he graduated from Davidson College with a B.S. in Physics.

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