Event

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Tuesday, May 28, 2019

Las Vegas, NV

Sponsored by the IEEE's Electronics Packaging Society (EPS),The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2019 will be held along with the 67th Electronic Components and Technology Conference (ECTC 2019 - http://www.ectc.net), a premier electronics packaging conference at The Cosmopolitan of Las Vegas, Las Vegas, NV USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2019 will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

Several CALCE professors will be contributing to this year's event. Prof. Abhijit Dasgupta is serving as the Mechanics & Reliability Track Chair. In addition, he will present three papers: Uniaxial Creep Response of Double-Coated Pressure Sensitive Adhesive (PSA), Fiber Optic Conjugate-Stress Sensor for Local Stiffness Changes Under Quasistatic Loads, and Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode.

Prof. McCluskey will provide a course titled Integrated Thermal Packaging and Reliability of Power Electronics and present the paper Cooling for Electric Aircraft Motors.

Prof. Bongtae Han's paper, Concept of the 3rd Generation of Reliability for Electronic Smart Systems, will also be presented at the conference.

More information is available here.