CALCE Webinar - Data and Models for Electronic Component Reliability Assessment
Tuesday, November 13, 2018
There has been and still is a perception that military and other higher grade electronic components provide more information and better reliability than Commercial off the Shelf (COTS) devices. With the continued growth of information availability for commercial electronic components, this perception of lower quality and reliability is not well supported. However, due to this perception, determining the usability of COTS semiconductor components in reliability critical applications is an issue for some organizations. An information based reliability assessment of COTS devices can be completed to estimate comparative reliability of COTS components compared with special grade components, allowing determination if a COTS component meets the application requirements.
An analysis of what information is provided by manufacturers and useful for completing reliability estimations has also been evaluated. Information sources can include the component datasheet, product change notifications (PCNs), design notes, material declaration documents, application notes, and other sources from outside the manufacturer website. Evaluation metrics have been developed to analyze the quality, consistency, accuracy, and ease of access of manufacturer information. One parameter commonly found in failure mechanism models is junction temperature, requiring information such as operating temperature range, thermal resistance, and power dissipation. A metric based on the completeness of thermal information provided for a component has been developed for comparison of components and the results of the analysis are used in the associated failure mechanism models. Another metric evaluates the availability of material declaration information, such as IPC 1752, from a manufacturer. These metrics and subsequent reliability analysis are evaluated on a sample component list with discrete semiconductor devices from 12 manufacturers.
About the Speaker
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices.
His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics.
Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group.
Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development.