Abstract:  Counterfeit assemblies and products are becoming more common and problematic. However, detection methods for them remain scattered and ad-hoc. We realized that many SAE AS6171 component test methods could be applied to assemblies as well and we built the structure of our document around that idea. Our process identifies where test approaches may deviate from the standard test method. We list all the test methods and then each test method is addressed for its suitability to assembly level testing and addresses how the test method may be used at the assembly level. We will close with some examples of counterfeit assemblies and how these methods can be applied there. We will also cover the aspects of assembly supply chain and information channels that result in additional difficulties with detection and avoidance

Bio: Dr. Diganta Das(Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA.