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Defense Electronics

Military Industry

For more than 15 years, CALCE EPSC has been developing tools and methodologies to help engineers assess, mitigate, and manage risks in electronic products. We have been working with companies from all sectors of the electronics industry, representing complete supply chains in the telecommunications, automotive, and avionics industries. This section of our website has been created to assist engineers within the military industry. It highlights CALCE EPSC resources and solutions of particular interest to this sector, specifically the following:

  • Performing a virtual qualification of products prior to prototype build and test
  • Creating an effective parts selection and management process
  • Uprating commercial parts for use outside the recommended operating temperature range
  • Developing sustainability protocols
  • Improving thermal management
  • Analyzing and simulating the Electromagnetic Compatibility
  • Using parts in high temperature applications
  • Developing an accelerated product qualification and quality assurance program

Please feel free to contact us if you have further questions or are looking for solutions and innovation to decrease life-cycle risks for your next generation of electronic products and systems. We look forward to working together with you.

Current Government and Military Members
Organization Designated Site(s)
Rolls Royce Birmingham, UK
Sandia National Labs Albuquerque, NM

 

A Perspective of the IPC Report on Lead-Free Electronics in Military/Aerospace Applications, Aleksandra Fortiera and Michael G. Pecht, Microelectronics Reliability, Volume 69, pp. 66-70, February 2017.

Critical review of U.S. Military environmental stress screening (ESS) handbook, Nga Man Li and Diganta Das, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR), Pensacola Beach, FL, 2016, pp. 1-10.

Disposable Electronics in Military and Avionics Systems, P. Sandborn, A. Wilson, and T. Jazouli, Proceedings DMSMS Conference, Hollywood, FL, August 2011.

Effectiveness of Conformal Coatings on Surface Mount Components as Tin Whisker Mitigation, S. Han, C. Johnson, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.

Likelihood of Metal Vapor Arc by Tin Whiskers, S. Han, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.

Thermal Cycling Reliability of Sn96.5Ag3.0Cu0.5 Solder Assembled with ENIG and OSP Pad Finishes, P. Chauhan, M. Osterman and M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.

CLCC Solder Joint Life Prediction under Complex Temperature Cycling Loading, F. Chai, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.

Technology Assessment of Sensor Systems for Prognostics and Health Monitoring, B. Tuchband, S. Cheng, and M. Pecht, IMAPS on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications (MASH), May, 2007.

The Use of Prognostics in Military Electronic Systems, B. Tuchband and M. Pecht, Proceedings of the 32nd GOMACTech Conference, pp. 157-160, Lake Buena Vista, FL, March 19-22, 2007.

Parameter Re-characterization Case Study: Electrical Performance Comparison of the Military and Commercial Versions of a TI Octal Buffer, N. Pendse and M. Pecht, Future Circuits International, Vol. 6, pp. 63-67, Technology Publishing Ltd, London, UK, 2000.

Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government, M. Pecht, Circuit World, Vol. 22, No. 2, pp. 7-15, 1996.

The Future of Military Standards - A Focus on Electronics, M. Pecht and E. Hakim, IEEE Aerospace and Electronic Systems, Vol. 17 (7), pp. 16-19, 1993.

Transition of MIL-STD-785 from a Military to a Physics-of-failure based Com-military Document, M. Pecht, A. Malhotra, D. Wolfowitz, M. Oren and M. Cushing, 9th Int'l Conf. of the Israel Society for Quality Assurance, Jerusalem, Israel, November 16-19, 1992.

Commercial Microcircuit Options in Military Avionics Systems Demand Reliability, L. Condra and M. Pecht, Defense Electronics, August, 1991.


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