Defect Description
Cracks initiated at solder joints that are prone to propagation upon the exposure to environmental stresses.
Defect Formation Process(s)
Common causes of this defect can be mechanical overstress of the solder joint during manufacturing. Another cause can be the inclusion of solid contaminants during plating.
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List of Tests to Precipitate this Defect |
Failure Acceleration |
Likelihood to Precipitate this Defect (condition) |
Failure Mechanism(s) |
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Thermal Shock |
• Cyclic thermal mechanical stress accelerates crack growth due to the local stress concentration • Thermal mechanical stress causes fracture of the solder joint at the cracks where local stress concentration is high |
✔ |
Thermal Fatigue Thermal Mechanical Overstress |
|
Random Vibration (RS/ED) |
• Random Vibration accelerates crack growth due to the local stress concentration • Vibration causes fracture of the solder joint at the cracks where local stress concentration is high |
✔/✇ |
Mechanical Fatigue Mechanical Overstress |
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Combined Environment |
• Combination of Thermal Shock and Random Vibration |
✔ |
Combination of Thermal Shock and Random Vibration |
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Bend Test |
• Bending can cause fracture of the solder joint at the cracks where local stress concentration is high |
✇ |
Mechanical Overstress |
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