Microelectronics Powering America's Defense

Matthew Hicks [Northrop Grumman]

Abstract: 

Modern warfare increasingly relies on multifunctional capabilities, driven by the need to sense a diverse array of signals across the electromagnetic spectrum. This diversity makes it challenging to conceal activities and enhances situational awareness. As the deployment of proliferated unmanned platforms accelerates, there is a parallel drive to make these systems smaller and more integrated. Advances in microelectronics integration are pivotal to this trend, offering enhanced functionality within ever- diminishing physical spaces. These technological innovations are crucial for large, high- value platforms and distributed systems that work in concert to achieve mission objectives.

Microelectronics have simplified U.S. Government (USG) systems while simultaneously improving Size, Weight, Power, and Cost (SWAP-C) efficiencies. The USG extensively leverages the domestic semiconductor industry but requires additional capabilities to meet both current and future mission-critical dual-use needs. Notably, the USG microelectronics industry is at several pivotal points of technological advancement, poised to enhance the performance and capabilities of future USG systems significantly.

The future lies in ubiquitous sensors and processing capabilities. Microelectronics are key to powering sensors, connecting information streams, and enabling edge decision analysis. However, realizing this vision depends on a secure and resilient supply chain to ensure the integrity and reliability of these critical technologies. As we advance, securing this supply chain becomes imperative to maintaining the USG's operational superiority and strategic advantage.

Biography: 

Matt Hicks is the Sr. Director of Northrop Grumman’s Foundries, Test & Advanced Packaging (FTAP) organization. This organization consists of the Advanced Technologies Labs (ATL; based in Linthicum Heights, MD), Space Park Foundry (SPF; based in Redondo Beach, CA) and Advanced Packaging (based in Linthicum Heights, MD, Redondo Beach, CA and Apopka, FL). FTAP facilities designs, fabricates, packages, and tests discriminating microelectronic devices that provide enabling system capabilities for defense applications. The FTAP organizations have been delivering microelectronics for over 75 years, with annual deliveries exceeding 1,000,000 devices per year, leveraging over 1,000 staff. FTAP is part of the larger Northrop Grumman Microelectronic Center (NGMC). Hicks previously held positions within NG as a Director of ATL, Program Manager for Space Payloads and Program Manager for Microelectronics. Throughout his career, he has supported programs ranging from fiber optic laser detonators, weak-link sensors, DMEA Trusted Foundry programs, semiconductor heterogeneous integration, advanced-node semiconductor development & integration, digital drop-on- demand printing technology, and several restricted programs. The commonality is providing facilitation and program management support to bring nationally strategic programs from R&D maturity into scaled production. Hicks received his B.S. degree in Electrical Engineering / Microelectronic Engineering from Rochester Institute of Technology and his M.B.A. degree from Temple University. Northrop Grumman solves the toughest problems in space, aeronautics, defense, and cyberspace to meet the ever-evolving needs of our customers worldwide. Our 90,000 employees define possible every day by using science, technology, and engineering to create and deliver advanced systems, products, and services.

Dr. Diganta Das

For more information or questions regarding the technical program (including Professional Development Courses), contact the Conference Chair, Dr. Diganta Das

Kristin Nafstad

For more information or questions regarding event logistics, exhibitions, and sponsorship, contact Kristin Nafstad.