A Global View Versus a U.S. Focus on Outsourced Assembly and Test (OSAT) Facilities to Support Wafer Level Packaging

Charles G. Woychik [NHanced Semiconductors, Inc]

Abstract: 

The future of Outsourced Assembly and Test (OSAT) facilities in the United States is at a critical juncture. Driven by advancements in semiconductor technologies, the increasing complexity of integrated circuit packaging, and growing demand for more sophisticated electronics, U.S.-based OSAT providers have an opportunity to evolve into a key player in the global semiconductor landscape. The strategic focus on advanced packaging technologies—such as 2.5D and 3D integration, wafer-level packaging, and chiplet architectures—will be essential to addressing the performance, power, and density requirements of next-generation applications in AI, 5G, autonomous systems, and high-performance computing.

However, the success of U.S. OSATs will depend heavily on their ability to compete with established Global leaders in Asia, where lower labor costs, mature infrastructure, and economies of scale give companies like ASE Technology and Amkor a significant advantage. To overcome these challenges, U.S. OSAT facilities must leverage government support, such as funding from the CHIPS Act, to invest in state-of-the-art equipment, attract highly skilled talent, and foster innovation in both packaging and testing methodologies.

In parallel, collaborations between OSATs, Integrated Device Manufacturers (IDMs), and fabless companies will be essential to ensuring alignment between packaging innovations and the evolving needs of the semiconductor industry. Moreover, the adoption of AI-driven test solutions and big data analytics will play a crucial role in improving test efficiency, yield optimization, and defect detection—further enhancing the competitiveness of U.S. OSATs.

In conclusion, while challenges remain with Global OSATs mainly in Asia, the U.S. is well- positioned to build a more resilient and advanced OSAT sector by capitalizing on emerging technologies and strategic government initiatives. By doing so, the U.S. can reduce its reliance on foreign supply chains and secure a stronger foothold in the global semiconductor ecosystem.

Biography: 

Charles Woychik is currently the VP of Sales and Marketing at NHanced Semiconductor, Inc. Previously, he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research, and IBM. He holds a Doctorate and Master of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 123 issued US patents to his credit.

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