Companies that design and/or manufacture electronics for the computer and consumer market have unique issues in regards to ensuring product quality and reliability. Consumer demands can often lead to rapid insertion of new technologies. High volumes and low cost margins require high yield and low infant mortality. Ensuring customer satisfaction results in the need for very accurate reliability prediction. And all of these demands must fall within tight cost constraints and time-to-market requirements.

This section of the CALCE EPSC website has been created to assist designers, quality specialists and reliability engineers within the computer and consumer electronics market. It highlights resources and solutions that are of particular interest to this sector. This includes:

  • Insertion of the latest technologies: embedded passives, MEMS devices, photonics and opto-electronic devices, lead-free solder, flip chip packaging.
  • Ensuring high yield and low infant mortality through assessment of your supply chain: component manufacturers, component distributors, board fabricators, contract assemblers
  • Using reliability science based reliability prediction to meet customer expectations: virtual qualification and design-for-reliability (DFR), reliability of liquid crystal displays, qualifying flux chemistries, the effect of impact and mechanical shock (mobile devices)

Please feel free to contact us if you have further questions or are looking for solutions and innovation to decrease life-cycle risks for your next generation of electronic products and systems. We look forward to working together with you.

Current Computer and Consumer Members
Organization Designated Site(s)
Dell Computer Corp. Round Rock, TX
HP, Inc. Houston, TX
Microsoft Redmond, WA
Salo, Finland
Oracle America San Diego, CA
Menlo Park, CA
ReliaSoft Corp. Tucson, AZ


The Effect of Epoxy/Glass Interfaces on CAF Failures in Printed Circuit Boards, Bhanu Sood and Michael Pecht, Microelectronics Reliability, Vol. 82, PP. 235-243, March, 2018, DOI: 10.1109/ACCESS.2018.2805281.

Failure of Polymer Aluminum Electrolytic Capacitors Under Elevated Temperature Humidity Environments, Anshul, Shrivastava, Michael Azarian, and Michael Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2017.

Electronic Circuit Health Estimation Through Kernel Learning, Arvind Vasan and Michael Pecht, IEEE Transactions on Industrial Electronics, Vol. PP, No. 99, July 2017.

Viscoplastic Properties of pressure-less sintered silver materials using indentation, D. Leslie, A. Dasgupta, and Carlos Morillo, Microelectronics Reliability, Vol. 74, 121-130, 2017.

Thermal degradation of Polyimide Insulation and Its Effect on Electromagnetic Coil Impedance, N. Jordan Jameson, Michael H. Azarian, and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.

Shelf Life Evaluation Method for Electronic and other Components using a Physics of Failure (PoF) Approach, Nga Man Li, Diganta Das,and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.

Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.

Moisture ingress, behavior and prediction inside semiconductor packaging: A review, Bongtae Han and Dae-Suk Kim, Journal of Electronic Packaging, Vol. 139, pp. 1-11, March 2017.

Blister testing for adhesion strength measurement of polymer films subjected to environmental conditions, Kenny Mahan, David Rosen, and Bongtae Han, Journal of Electronic Packaging, Vol. 138, pp. 1-8, December 2016.