Defect Description

Solders that exhibit poor wetting and possess a grayish, porous appearance [1]

Defect Formation Process(s)

Insufficient solder can be a result of non-optimized soldering process and different factors such as the assembly design, assembly process, shape of solder wave, etc. [1]

List of Tests to Precipitate this Defect

Failure Acceleration

Likelihood to Precipitate this Defect (condition)

Failure Mechanism(s)

Thermal Shock

• Cyclic thermal mechanical stress accelerates crack initiation or growth of the weak solder joint

• Thermal mechanical stress causes fracture of the weak solder joint

Thermal Faitgue

Thermal mechanical Oberstress

Random Vibration (RS/ED)

• Random Vibration accelerates fatigue cracking of the weak solder joint

• Random Vibration can cause fracture of the weak solder joint

✔/✇
(Defect orientation is sensitive to the vibration axes)

Mechanical Fatigue

Mechanical Overstress

Combined Environment

• Combination of Thermal Shock and Random Vibration

Combination of Thermal Shock and Random Vibration

Bend Test

• Bending can cause fracture of the weak solder joint


(Defect at a location with significant strain due to bending)

Mechanical Overstress

 


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