On October 16 and 17, 2024, the Center for Advanced Life Cycle Engineering conducted its bi-annual Reliability Science symposium and research planning meetings. This meeting was hybrid at the University of Maryland and virtually via Zoom, and it included an overview of CALCE research activities with several detailed research project presentations.

CALCE investigators presented the following project reports on October 16:

  • Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints
  • Reliability of 3rd Generation Lead-free Solder Interconnects
  • Reliability of Low-Temperature Solder Interconnects
  • Development of Advanced Board Level Reliability Prediction
  • Model for Power Devices under Autonomous Driving Condition
  • Development of Derating Guidelines for Lithium Ion Batteries
  • Evaluation of Multilayer Ceramic Capacitors MLCCs for Use with Ripple Current
  • Fretting Wear and Lubrication of Polymer/Metal Contacts
  • Development of a PHM Methodology for Printed Circuit Board Assemblies
  • Paint Delamination and Scratch Resilience for Electronic Products
  • Guidelines for Storage of Printed Board Assemblies and Electronic Equipment

CALCE will conduct the following research projects in the 2025 research year. The plans for their execution was presented on October 17.

  • Rapid Assessment of Electronic Products Using Side-Channel Power Modulation Analysis
  • Rapid Assessment of Electronic Products Using Side-Channel Power Modulation Analysis
  • Rapid Assessment of Electronic Products Using Side-Channel Power Modulation Analysis
  • Fretting of Electrical Contacts Finished with Electroless Gold
  • Guidelines for Storage of Printed Board Assemblies and Electronic Equipment
  • Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints
  • Coating Durability in Electronic Products
  • Physics of Failure-Based Electronic Product Design Review
  • Reliability of 3 rd Generation Lead-free Solder Interconnects
  • Reliability of Low-Temperature Solder Interconnects

For more information about the event and if you are interested in attending future CALCE Reliability Science Symposiums, please get in touch with Dr. Michael Osterman.


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