On October 25 and 26, 2023, the Center for Advanced Life Cycle Engineering conducted its bi-annual Reliability Science symposium and research planning meetings. This was a hybrid meeting at the University of Maryland and virtually via Zoom, and it included an overview of CALCE research activities with several detailed research project presentations.
| Topics Presented on Oct 25, 2023 | ||
|---|---|---|
| Solder Performance and Reliability Assurance Project | Keynote Speaker: Dr. Michael Osterman | |
| Fatigue under Multiaxial Cyclic Creep and Plasticity in Oligocrystalline SAC Solder Joints | A. Bharamgonda, A. Dasgupta | |
| Reliability of 3rd Generation Lead-free Solder Interconnects | Aaron Mendelson and Dr. Michael Osterman | |
| Reliability of Low-Temperature Solder Interconnects | Aaron Mendelsohn and Dr. Michael Osterman | |
| Board Level Reliability Assessment of Bi-based Hybrid Low Melting Solder as a Function of Bi Diffusion | Yongrae Jang, Jack Yang and Prof. Bongtae Han | |
| Diamond Electronics, For High Temperature, High Power Applications | Prof. Aris Christou | |
| Component Selection for Use Beyond Specifications | Harsha Walvekar and Dr. Diganta Das | |
| Component Life Assessment Methodology Development | Lokesh Sangepu, Rudra Vora and Dr. Diganta Das | |
| Discrete Component Qualification Methods | Dr. Diganta Das | |
| Selection Criteria for Use of Multilayer Ceramic Capacitors (MLCCs) with Ripple Current Loading Conditions | Dr. Michael H. Azarian and Nikhil Bharadwaj Kulkarni | |
| Quality and Reliability Benefits of AEC-Q200 Class II X7R Multilayer Ceramic Capacitors (MLCCs) | Nikhil Bharadwaj Kulkarni, Huwei Dong and Dr. Michael H. Azarian | |
|
Evaluation and Selection of Lubricants for Mechanical Interfaces
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Soma Roy and Dr. Michael H. Azarian
|
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| Paint Adhesion Reliability | P. Janamanchi, Prof. A. Dasgupta, L. Vandegriff | |
| Reliability of Printed RF circuits under Temperature Cycling, THB, and Vibration Conditions | Hisham Abusalma, Swarup Subudhi, Prof. Abhijit Dasgupta, Prof. Siddhartha Das | |
| Creep Properties of Sintered Silver Conductors and Interconnects | D. Leslie, Prof. A. Dasgupta | |
| Extreme Drop Durability of Printed Hybrid Electronics | Hayden Richards, Hisham Abusalma, Prof. Abhijit Dasgupta | |
| A Protection-Level Preservation-Based Additive Manufacturing System Life-Cycle Model | Shao-Peng Chen, Prof. Peter Sandborn | |
| Swelling Tests for Li-Batteries | Sahithi Maddipatla, Dr. Michael Osterman, and Prof. Michael Pecht | |
| Rapid Assessment of Electronic Products Using Side-Channel Analysis | Devon Richman Dr. Michael H. Azarian | |
For more information about the event and if you are interested in attending future CALCE Reliability Science Symposiums, please contact Dr. Michael Osterman.
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