On October 25 and 26, 2023, the Center for Advanced Life Cycle Engineering conducted its bi-annual Reliability Science symposium and research planning meetings. This was a hybrid meeting at the University of Maryland and virtually via Zoom, and it included an overview of CALCE research activities with several detailed research project presentations.
Topics Presented on Oct 25, 2023 | ||
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Solder Performance and Reliability Assurance Project | Keynote Speaker: Dr. Michael Osterman | |
Fatigue under Multiaxial Cyclic Creep and Plasticity in Oligocrystalline SAC Solder Joints | A. Bharamgonda, A. Dasgupta | |
Reliability of 3rd Generation Lead-free Solder Interconnects | Aaron Mendelson and Dr. Michael Osterman | |
Reliability of Low-Temperature Solder Interconnects | Aaron Mendelsohn and Dr. Michael Osterman | |
Board Level Reliability Assessment of Bi-based Hybrid Low Melting Solder as a Function of Bi Diffusion | Yongrae Jang, Jack Yang and Prof. Bongtae Han | |
Diamond Electronics, For High Temperature, High Power Applications | Prof. Aris Christou | |
Component Selection for Use Beyond Specifications | Harsha Walvekar and Dr. Diganta Das | |
Component Life Assessment Methodology Development | Lokesh Sangepu, Rudra Vora and Dr. Diganta Das | |
Discrete Component Qualification Methods | Dr. Diganta Das | |
Selection Criteria for Use of Multilayer Ceramic Capacitors (MLCCs) with Ripple Current Loading Conditions | Dr. Michael H. Azarian and Nikhil Bharadwaj Kulkarni | |
Quality and Reliability Benefits of AEC-Q200 Class II X7R Multilayer Ceramic Capacitors (MLCCs) | Nikhil Bharadwaj Kulkarni, Huwei Dong and Dr. Michael H. Azarian | |
Evaluation and Selection of Lubricants for Mechanical Interfaces
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Soma Roy and Dr. Michael H. Azarian
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Paint Adhesion Reliability | P. Janamanchi, Prof. A. Dasgupta, L. Vandegriff | |
Reliability of Printed RF circuits under Temperature Cycling, THB, and Vibration Conditions | Hisham Abusalma, Swarup Subudhi, Prof. Abhijit Dasgupta, Prof. Siddhartha Das | |
Creep Properties of Sintered Silver Conductors and Interconnects | D. Leslie, Prof. A. Dasgupta | |
Extreme Drop Durability of Printed Hybrid Electronics | Hayden Richards, Hisham Abusalma, Prof. Abhijit Dasgupta | |
A Protection-Level Preservation-Based Additive Manufacturing System Life-Cycle Model | Shao-Peng Chen, Prof. Peter Sandborn | |
Swelling Tests for Li-Batteries | Sahithi Maddipatla, Dr. Michael Osterman, and Prof. Michael Pecht | |
Rapid Assessment of Electronic Products Using Side-Channel Analysis | Devon Richman Dr. Michael H. Azarian |
For more information about the event and if you are interested in attending future CALCE Reliability Science Symposiums, please contact Dr. Michael Osterman.
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