ASME InterPACK Organises a Symposium honoring Prof. Abhijit Dasgupta

The American Society of Mechanical Engineers (ASME) is organizing a Symposium as a tribute to Prof. Abhijit Dasgupta's contribution to the field of multiscale modelling and reliability. Besides Prof. Dasgupta, all other presenters are his current or former students. Prof. McCluskey will be giving a Plenary Talk introducing the symposium titled "Past and Future of Reliability Assessment of Electronic Materials," which will highlight Prof. Dasgupta's contributions.

Abhijit Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland (UMD), with research experience in the microscale and nanoscale mechanics and reliability physics of engineered materials used in conventionally and additively manufactured heterogeneous flexible electronic systems and intelligent microsystems.  He holds a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC) and has been a principal investigator at the Center for Advanced Life Cycle Engineering (CALCE) at UMD for over 30 years, conducting research in reliability physics, design for reliability, accelerated stress testing, and real-time health management.  He has published over 300 articles and conference papers; served on editorial boards of three international archival journals; presented over 50 workshops and short courses; helped form research and educational roadmaps for the electronics industry, and provided consulting services to numerous industry leaders.   He has presented numerous keynote talks at international conferences, received 6 best-paper awards and received 8 major awards in recognition of his research and educational contributions.  He is an ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging Division (EPPD), past member of the ASME Design, Manufacturing and Materials Segment Leadership Team (DMM-SLT) and Current Chair of the Reliability Technology Working Group in the Heterogeneous Integration Roadmap (HIR) Team sponsored by IEEE/ASME/SEMI/IEPS/EDS.

 

Session Chairs: 

Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Department’s Director of Undergraduate Studies.  He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications.  Dr. McCluskey has co-authored three books, 5 US Patents, and over 175 peer-reviewed technical articles with nearly 4000 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, co-chair of the Integrated Power Electronics technical working group of the IEEE Heterogeneous Integration Roadmap, Awards Director and Member of the Board of Governors of the IEEE Electronic Packaging Society, Fellow and Member of the Executive Council of IMAPS, and a member of ASME and AIAA. 

 

 

 

Pradeep Sharma is the Hugh Roy and Lillie Cranz Cullen Distinguished University Professor & Department Chair of Mechanical Engineering at The University of Houston. He became one of the 22 international members to be elected for NAE in 2022 as the organization recognized Sharma for establishing the study of flexoelectricity. His research interests lie in Solid mechanics, Theoretical and computational materials science, Multifunctional materials, Flexoelectricity, Mechanics and physics of soft matter, Mechanics and physics of cells, Atomistic simulations, Homogenization, Mechanical behaviour of materials, Data sciences and machine learning, Damage and failure prediction of materials. Dr. Sharma received his M.S and Ph.D. from the University of Maryland in 2000.

 

 

 

 

Session 1: October 26, 2022, 10:15 AM - 11:45 AM

 

 

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Session 2: October 26, 2022, 2:15 PM - 3:45 PM