For more than 15 years, CALCE EPSC has been developing tools and methodologies to help engineers assess, mitigate, and manage risks in electronic products. We have been working with companies from all sectors of the electronics industry, representing complete supply chains in the telecommunications, automotive, and avionics industries. This section of our website has been created to assist engineers within the aerospace and avionics industries. It highlights CALCE EPSC resources and solutions of particular interest to this sector, specifically the following:

  • Performing return on investment analysis for Prognostics Health Management (PHM)

  • Performing a Virtual Qualification of products prior to prototype build and test

  • Creating an effective parts selection and management process

  • Uprating commercial parts for use outside the recommended operating temperature range 

  • Managing obsolete parts to minimize the cost impact

  • Optimizing design refresh schedule and content based on part obsolescence forecasts

  • Forecasting part obsolescence

  • Improving the thermal management for avionic systems

  • Analyzing and simulating the electromagnetic compatibility of avionics equipment 

  • Using parts in high temperature applications

  • Developing an accelerated product qualification and quality assurance program

  • Assessing the reliability of liquid crystal displays

Please contact us if you have further questions or are looking for solutions and innovations to decrease life-cycle risks for your next generation of electronic products and systems. We look forward to working together with you.

CALCE Aerospace News Letter - October 2015


Current Aerospace and Avionics Members
Organization Designated Site(s)
BAE Systems Endicott, NY
General Electric Grand Rapids, MI
Jacksonville, FL
L3-Harris Corporation Melbourne, FL
Columbia, MD
Salt Lake City, UT
Alpharetta, GA
Honeywell Tucson, AZ
Phoenix, AZ
Clearwater, FL
Mississauga, ON, Canada
Collins Aerospace
(formerly UTAS)
Windsor Locks, CT
Rockford, IL


A Perspective of the IPC Report on Lead-Free Electronics in Military/Aerospace Applications, Aleksandra Fortiera and Michael G. Pecht, Microelectronics Reliability, Volume 69, pp. 66-70, February 2017.

Disposable Electronics in Military and Avionics Systems, P. Sandborn, A. Wilson, and T. Jazouli, Proceedings DMSMS Conference, Hollywood, FL, August 2011.

Electrostatic Monitoring of Gas Path Debris for Aero-engines, Z. Wen, H. Zuo, and M. Pecht, IEEE Transactions on Reliability, Vol. 60, No. 1, pp. 33-40, March 2011.

Research on Electrostatic Monitoring Technology for Aero-engine Gas Path, Wen, Z., H. Zuo, D.K. Lau and M. Pecht, 2010 Prognostics & System Health Management Conf., Macau, China, Jan. 12-14, 2010.

Life Cycle Cost Impact of using Prognostic Health Management (PHM) for Helicopter Avionics , E. Scanff, K.L. Feldman, S. Ghelam, Peter Sandborn, M. Glade, B. Fouch, Microelectronics Reliability 47 (2007) 1857-1864, 2007.

Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, pp. 242-247, June 2007.

Avionics Architecture Approach to the Sustainable Utilization of Commercial Technology, C. Wilkinson, IEEE Aerospace and Electronic Systems Magazine, Vol. 19, No. 10, pp. 7-10, October 2004.

Prognostics and Health Management for Avionics, Wilkinson, C., Humphrey, D., Vermeire, B., and Houston, J., IEEE Aerospace Conference, Big Sky, MT, March 2004.

Prognostics and Health Management for Improved Dispatchability of Integrated Modular Avionics Equipped Aircraft, C. Wilkinson, 23rd Digital Avionics Systems Conference (DASC), Salt Lake City, UT, October 2004.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, The SMTA International Annual Conference, Chicago, IL, September 21-25, 2003.

Remaining Life Assessment of Aging Electronics in Avionic Applications, R. Valentin, M. Osterman, and B. Newman, The Annual Reliability and Maintainability, 2003 Proceedings, pp. 313-318, Tampa Florida, January 27-30, 2003.

Recommendations for Future Avionics Hardware Development, C. Wilkinson, M. Pecht, J. Wasson, and L. Condra, Proceedings of the World Aviation Congress, Phoenix, AZ, November 2002.

Determining Optimum Redesign Plans for Avionics Considering Electronic Part Obsolescence Forecasts, P. Singh, P. Sandborn, D. Lorenson, and T. Geiser, Proceedings World Aviation Congress (SAE Technical Paper: 2002-1-3012), Phoenix, AZ, November 2002.

Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.

An Avionics Guide to Uprating of Electronic Parts, D. Humphrey, L. Condra, N. Pends, D. Das, C. Wilkinson and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 595-599, September, 2000.

Use of thermal analysis information in avionics equipment development, D. Das, Electronics Cooling, Vol. 5, No. 3, September 1999.

Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials (PCMs), D. Pal and Y. Joshi, AIAA Journal of Thermophysics and Heat Transfer, Vol. 12, pp. 256-262, 1998

Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment, K. Cluff, D. Barker, D. Robbins and T. Edwards, Proceedings-Institute of Environmental Sciences, pp. 50-57, 1996.

The Role of Heat Transfer Analysis in Avionics Equipment Development, D. Das and M. Pecht, ASME Proceedings of the 32nd National Heat Transfer Conference, Vol. 7, HTD-Vol. 329, pp. 197-209, August. 1996.

Commercial Microcircuit Options in Military Avionics Systems Demand Reliability, L. Condra and M. Pecht, Defense Electronics, August, 1991.