Risk Mitigation Using Electrical Testing in Today’s Ever-Changing Counterfeiting Techniques for Microelectronic Devices  

Sultan Ali Lilani [Integra Technologies]

Abstract: 

Today’ counterfeiters have started to introduce very sophisticated counterfeit parts within the EEE domain these parts cannot be readily verified whether these parts are authentic or not. The counterfeiters are using such technics as cloning and are using processes that do not leave any physical traces on the device to be able to be detected using such conventional techniques as limited AC/DC Electrical Testing, X-Ray, External Visual, XRF, and Decap amongst others. The presentation will explore how very comprehensive electrical testing can detect these advanced counterfeit parts. The paper will explore the electrical tests needed to verify such advanced counterfeiting.

Biography:

Sultan Ali Lilani [Integra Technologies]

Sultan has in-depth knowledge of Reliability Engineering, Testing, Qualification for Aerospace, Defense, and Industrial applications for microelectronics products of various technologies. Sultan has served in various industry committees including being the current SAE chair for PEMs Committee, current co-chair of the Copper Bond Wire Committee, current co-chair of the SAE CE-12 Counterfeit Committee, and former co-chair of the SAE G19A Committee which developed the AS6171 standards to detect suspect counterfeit components.

 

 

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