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Dr. Bongtae Han received his B.S. and M.S. degrees in Energy Resources Engineering from Seoul National University in 1981 and 1983, respectively, and his Ph.D. in Engineering Mechanics from Virginia Tech in 1991. He is currently a Keystone Professor of Engineering at the University of Maryland. He coauthored the textbook High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials (Springer-Verlag, 1997) and edited two additional books. He has published 13 book chapters and more than 350 journal and conference papers in microelectronics, photonics, and experimental mechanics.
Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994. He was the recipient of the 2002 Society for Experimental Mechanics (SEM) Brewer Award for his contributions to the development of photomechanics tools for semiconductor packaging. In 2015, he received the ASME Mechanics Award from the Electronic and Photonic Packaging Division for his contributions to the structural mechanics of electronic systems. In 2026, he received the IEEE Electronics Packaging Society (EPS) Outstanding Sustained Technical Contribution Award for his contributions to electronic packaging design for reliability and workforce development, particularly his work on measuring advanced-package behavior and material properties. He was also appointed a Distinguished Lecturer by the IEEE EPS for a four-year term beginning January 1, 2027. He has received several publication awards, including the 2004 Best Paper Award from IEEE Transactions on Components and Packaging Technologies.
Dr. Han was elected a Fellow of SEM in 2006 and a Fellow of ASME in 2007. He currently serves as Editor-in-Chief of Microelectronics Reliability, published by Elsevier.
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