LED Assembly, Reliability, and Testing (A.R.T.) Symposium

Technical Symposium & Expo: November 28-29, 2017

Workshops: November 30, 2017

Research Triangle Park, NC





Program Chair: Dr. Diganta Das, CALCE (diganta@umd.edu)

CALCE EPS Consortium members have access to the full presentations.

Symposium Attendees may request access to the material by filling out the LED A.R.T. 2017 Attendee Registration Form (please type LED A.R.T. 2017 Attendee in the comment field).

If you are not a member or attendee, you will need to register for Articles access account.

 

Tuesday, November 28
Topic
Speaker
Session 1: Opening Session
Opening Remarks

Diganta Das, Ph.D., CALCE, University of Maryland
Keynote Address 1: High Power LED Solder Joint Reliability

Ralph C. Tuttle, CREE
Session 2: LED Applications
Optical Wireless Communication Using LEDs for Smart Lighting IoT

John Muth, North Carolina State University
High Reliability Solder Alloy for Automotive LED Applications

Jie Geng, Ph.D., Indium Corporation
Counterfeit LEDs and How to Detect Them

Diganta Das, Ph.D., CALCE, University of Maryland
Session 3: LED Packaging
Solder Alloy Selection for LED Die Bonding and Package Assembly

Nicholas Herrick, Alpha Assembly Solutions
Bonding a Ceramic XLamp® to an Al Heatsink with a Very Thin Bondline Using BondFlowT

Richard Koba, Ph.D., Materion and Jim Fravillig, Fraivillig Technologies
Flexible Reel-to-Reel Multi-Component LED Assembly Production

Gerald Steinwasser, Mühlbauer
Session 4: Failures and Failure Mechanisms
Creating Pad Peeling Failure Mechanisms with Reverse Voltage and Humidity for Chip LEDs

Önder Sünetci, Arcelik
Understanding LED Failures

Martine Simard-Normandin, Ph.D., MuAnalysis Inc.
LED Faults Found by 2D and CT X-Ray

Keith Bryant, Yxlon International
Wednesday, November 29
Session 5: LED Luminaires
Keynote Address 2: Assembly, Reliability, and Testing (A.R.T.) of LED Luminaires

Warren Weeks, Hubbel Lighting Inc.
Mimicking Real LED Lamp Stress Factors: Thermal Cycling in Luminaires and Lamp Failure Analysis

Kelly Roundtree, RTI International
Session 6: LED Solder Joint Reliability and Processing
Failure in LED Interconnects: Effects of Substrate Material and Solder Alloy

Maxim Serebreni, DfR Solutions
The Development of a Novel Solder Alloy to Improve LED Solder Interconnect Durability

Mehran Malalekian, Ph.D., AIM
Non-Destructive Hand Rework of LED Assemblies

Aaron Caplan, PACE Worldwide
Session 7: Board Processing with LEDs
Solder Flux Cleaning, Reliability, and Optical Performance of UV Flipchip LEDs

Nicholas Herrick, Alpha Assembly Solutions
LED Cleanliness Risk Assessment and Process Control at the Assembly Site

Mike Bixenman, DBA, KYZEN Corporation
Closing Comments

Diganta Das, Ph.D., CALCE, University of Maryland



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