CALCE Root Cause Failure Analysis of Electronics - Nov. 15-18, 2022

Tuesday, November 15, 2022

University of Maryland

Registration Is Full

Seating is limited. The course requires a minimum of 12 participants and can support up to 18. Registrants will be notified of the status of the course registration on or by October 21, 2022.

Course Date and Venue

The Course will be held from November 15 - 18, 2022 at the University of Maryland, College Park

Course Overview

This intensive 4-day course will cover specimen preparation and materials analysis techniques applicable to electronic assemblies, components, and devices. The course consists of a combination of classroom instruction, demonstrations, and hands-on laboratory training. Lecture topics include physics-of-failure root cause analysis, guidelines for the selection of analytical tools, practical instruction on laboratory techniques, and case studies drawn from CALCE’s research. The laboratory portion of the course includes demonstrations and step-by-step hands-on sample preparation using metallographic techniques on failure analysis and inspection equipment. In addition, a number of important non-destructive and destructive analysis techniques will be demonstrated. This is your opportunity to learn all about the latest failure analysis methods and critical failure mechanisms in electronics.

Each course attendee is invited to submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance, for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course, to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course.

Course Outline

  1. Root cause analysis
  2. Sample Preparation for Failure Analysis
  3. Non-destructive analysis techniques
  4. Destructive analysis
  5. Physics of failure
  6. Failure mechanisms of electronic products
  7. Material analysis techniques

Course Instructors

Lead Instructor

Dr. Michael Azarian | mazarian@umd.edu

Dr. Michael H. Azarian is a Research Scientist at CALCE. He holds a Masters and Ph.D. in Materials Science and Engineering from Carnegie Mellon University, and a Bachelors degree in Chemical Engineering from Princeton University. His research is focused on the analysis, detection, prediction, and prevention of failures in electronic and electromechanical products. He has over 150 publications and 6 U.S. patents involving electronic packaging, component reliability, prognostics and health management, and tribology. Dr. Azarian is chairman of the SAE G-19A standards committee on detection of counterfeit parts, which is responsible for the AS6171 and AS6810 family of standards, and chair of the standards committee for IEEE 1624 on organizational reliability capability.

 

Co-Instructor

Dr. Michael Osterman | osterman@umd.edu

Dr. Michael Osterman is a Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He holds a Ph.D. from the University of Maryland and he currently heads the development of simulation-assisted reliability assessment software for CALCE and simulation approaches for estimating the time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phases I and II of the Lead-free Manhattan Project sponsored by the Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP).

 

Co-Instructor

Dr. Robert Utter | rgutter@umd.edu

Dr. Robert Utter is a member of CALCE technical staff. Dr. Utter brings a wealth of experience in electronic product development ranging from material analysis to software development. Dr. Utter is a chemist with a doctorate from the University of Texas. He has held positions in contract manufacturing at Kimball International and material analysis at Alliant Techsystems Operations. His expertise includes in-depth knowledge of spectroscopy and microscopy essential for understanding electronic product reliability.

 

Contact

Dr. Michael Osterman
301-405-8023 | osterman@umd.edu
University of Maryland
College Park, MD 20742

For any course-related queries, please contact Dr. Michael Osterman

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