Event
69th IEEE Electronic Components and Technology Conference
Tuesday, May 28, 2019
8:00 a.m.
The Cosmopolitan of Las Vegas
At this year’s 69th IEEE Electronic Components and Technology Conference in Las Vegas, Professor Bongtae Han and Dr. Przemyslaw Gromala, Robert Bosch GmbH, will teach the short course Characterization of Advanced EMCs for FO-WLP, Heterogeneous Integration, and Automotive Electronics and Professor Patrick McCluskey will lead the course Integrated Thermal Packaging and Reliability of Power Electronics.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2019 ECTC will be held at The Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA, during May 28 – 31, 2019, featuring about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, an EPS Seminar, and a technology corner for exhibitors.
Characterization of Advanced EMCs for FO-WLP, Heterogeneous Integration, and Automotive Electronics by Prof. Bongtae Han and Przemyk Gromala
Course Objective: Epoxy-based molding compounds (EMCs) are widely used in the semiconductor industry as one of the most important encapsulating materials. For the advanced packaging technologies, in particular, FO-WLP technologies and heterogeneous integrations, EMCs play a more significant role than the conventional plastically-encapsulated packages because of thin profiles and complex process conditions required for the advanced packaging technologies. In the automotive industry where demand for more advanced packaging technologies increases rapidly for autonomous and connected cars, EMCs are often used to protect, not only individual IC components, but also entire electronic control units (ECUs), or power modules. The stress caused by the mismatch of the coefficient of thermal expansion (CTE) between EMCs and adjacent materials is one of the major causes of reliability problems (e.g., excessive warpage, delamination, BRL, etc.). During assembly or even operating conditions, EMCs are subjected to temperatures beyond the glass transition temperature. Around the glass transition temperature, EMCs exhibit significant volumetric and isochoric viscosity, which leads to nonlinear viscoelastic behavior. In contrast, at low temperatures, EMCs show linear viscoelastic behavior. This complex material characteristic in the full temperature range of interest renders the design of electronic devices a nontrivial task. The mechanical behavior of EMCs has to be understood clearly to offer predictive simulation strategies, which has become an integral part of product development process. This training will address details of such strategies, summarize the required material characterization procedure, and close with some representative examples
Integrated Thermal Packaging and Reliability of Power Electronics by Prof. Patrick McCluskey
Course Objective: Power electronics are becoming ubiquitous in engineered systems as they replace traditional ways to control the generation, distribution, and use of energy. They are used in products as diverse as home appliances, cell phone towers, aircraft, wind turbines, radar systems, smart grids, and data centers. This widespread incorporation has resulted in significant improvements in efficiency over previous technologies, but it also has made it essential that the reliability of power electronics be characterized and enhanced. Recently, increased power levels, made possible by new compound semiconductor materials, combined with increased packaging density have led to higher heat densities in power electronic systems, especially inside the switching module, making thermal management more critical to performance and reliability of power electronics. This course will emphasize approaches to integrated thermal packaging that address performance limits and reliability concerns associated with increased power levels and power density. Following a quick review of active heat transfer techniques, along with prognostic health management, this short course will present the latest developments in the materials (e.g. organic, flexible), packaging, assembly, and thermal management of power electronic modules, MEMS, and systems and the techniques used for their reliability assessment.
More information is available at the event website.
