CALCE Webinar - Does aging degrade the reliability of Pb-free solder interconnects?
Tuesday, January 15, 2019
Solder interconnect fatigue remains for a top failure mechanism in electronic products and systems. With the conversion to Pb-free solder interconnects, more than a decade back, the impact of a variety of factors on solder interconnect fatigue failure have been investigated form major classes for Pb-free solder material. In particular, the impact of aging on Pb-free solder properties has led to concern for aged electronic products. This webinar will examine the impact of temperature aging of Pb-free solder on temperature cycle fatigue. The presentation will examine both elevated temperature aging as well as room temperature aging. Results from tests along with comparison with properties of 10 year office stored interconnects will be presented and discussed. The Designers and reliability test developers will find this information useful in developing reliable products.
About the Presenter: Dr. Michael Osterman is a senior research scientist and director of the CALCE Electronics Products and Systems Consortium. He has published extensively on solder interconnect reliability and modeling for electronic products. He also leads the development of the CALCE Simulation Assisted Reliability Assessment software. He is member a senior member of IEEE and a member of SMTA and ASME.